Powering Next-Gen AI: JPC Powers NVIDIA Vera Rubin Architecture at Scale

Cecilia LuBlog

Powering AI Infrastructure at Scale: JPC in the NVIDIA AI Factory MGX™ Ecosystem

As AI data centers scale at an unprecedented pace, reliable high-power connectivity has become mission-critical. At Computex 2026, JPC Connectivity is showcasing advanced power solutions designed for the NVIDIA MGX™ platform—the modular architecture powering today’s AI factories.

The NVIDIA MGX™ platform enables faster, more flexible AI system design by integrating standardized components such as GPUs, CPUs, power, cooling, and networking. Its latest generation, built on the Vera Rubin platform, introduces some of the most power-dense AI rack systems ever deployed—demanding consistent, high-current delivery at production scale.

JPC plays a critical role in enabling Vera Rubin full production readiness. From early-stage design collaboration to volume manufacturing, JPC’s high-current cabling solutions are engineered to meet stringent electrical, thermal, and space requirements—ensuring stable and efficient power delivery across large-scale AI deployments.

Key solutions include:

  • 60A Power Whip (GB200 NVL72/ GB300 NVL72 platform) — ORV3-compliant, UL817 certified, with flexible lengths for seamless rack integration.
  • 100A Power Whip (Vera Rubin platform) — engineered for next-generation AI workloads, delivering sustained high-current performance, superior routing flexibility, and readiness for global deployment.
  • Busbar Solutions for Vera Rubin platform — supporting high-density power architectures with ORV3, 72kW (HPRv2), and 90kW+ designs operating at 54V DC with currents up to 200A, enabling efficient power distribution for next-generation AI racks.
  • Comprehensive ORV3 power portfolio & prototyping — including AC whip assemblies and rapid prototyping capabilities, helping customers accelerate from validation to full-scale production.

With over 30 years of experience and deep engineering expertise, JPC is a key enabler in bringing next-generation AI infrastructure from concept to deployment.

Visit JPC at COMPUTEX 2026 — Booth J0410, TaiNEX 1 (1F) to learn more!