We are excited to announce our participation in the upcoming DesignCon 2025, taking place at the Santa Clara Convention Center. We invite you to visit our booth on the following expo dates: January 29th-30th, to see the latest in high-speed design tools, technologies, and developments. DesignCon continues to be the go-to event for chip, board, and systems design engineers to network, discover cutting-edge solutions, and stay ahead of industry advancements.
Pactech, a JPC Company, has been one of the leading connectivity solution providers in San Jose, California, for more than 30 years. DesignCon provides the perfect platform for us to demonstrate our products and capability of our hi-power cable solutions.
At our booth, JPC will showcase a range of products, including:
- MCIO Series (MCIO 8X ST Gen6 & Low Loss FPC & Active MCIO… )
- Customizable Riser Cable
- IPEX on the CABLINE-CA IIP PLUS to MCIO
- Multi-Trak Series
- E3.1C & E3.2C
- Busbar Clip
- AC Whip ORV3(EU) & AC Whip ORV3(US)
Join us at DesignCon 2025 in booth #849!
Don’t miss this opportunity to explore our booth and learn more about our products and solutions firsthand. Save the date and prepare to be inspired!
Register in advance for the event with our promo code: INVITE977571 here.
We are looking forward to this opportunity to connect with industry leaders, share knowledge, and stay ahead of the curve in the hi-power connectivity solutions.
Visit our website to find out more about all the different solutions that we offer today!