Dear Valued Partners and Industry Colleagues,
Thank you for making DesignCon 2025 an exceptional experience for us at JPC and JPCPT DBA Pactech. As the premier high-speed communications and system design conference in Silicon Valley, this year’s event proved to be an invaluable platform for innovation and connection.
Event Highlights:
We were delighted to showcase our cutting-edge AI solutions alongside our partners at Anderson Power. The engaging discussions with industry leaders about emerging trends in AI data centers and high-performance cable solutions highlighted the dynamic future of our industry.
Featured Products
ORV3 Solution:
AI Data Solutions:
Looking Forward:
The insights and connections made at DesignCon 2025 will help shape our approach to future innovations and partnerships. As AI continues to reshape our world, this is the moment for us to push the limits of computing and high-speed connectivity.
Check out our newest post on LinkedIn: DesignCon 2025 Recap
Thank you again for being part of this remarkable event. We look forward to continuing our conversations and collaborations next year!
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